Sales & Support: Request A Quote
Home Productscutting tools

Nickel Bond Dicing Blade (1A8, 1A1 and 1A1R)

Nickel Bond Dicing Blade (1A8, 1A1 and 1A1R)

    • Nickel Bond Dicing Blade (1A8, 1A1 and 1A1R)
    • Nickel Bond Dicing Blade (1A8, 1A1 and 1A1R)
    • Nickel Bond Dicing Blade (1A8, 1A1 and 1A1R)
  • Nickel Bond Dicing Blade (1A8, 1A1 and 1A1R)

    Product Details:

    Place of Origin: china
    Brand Name: more super hard
    Certification: Iso9001:2008
    Model Number: more types

    Payment & Shipping Terms:

    Minimum Order Quantity: 1
    Price: 1.2
    Packaging Details: carton box
    Payment Terms: L/C, D/A, D/P, T/T, Western Union, MoneyGram
    Supply Ability: 3000/month
    Contact Now
    Detailed Product Description
    Color: Yellow Material: Diamond

    Diamond Dicing Blades

    diamond dicing blades

    Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.

    The Type: diamond hub dicing blade and diamond hubless dicing blade

     

    Electroformed diamond hub dicing blade

    Electroformed dicing

    blade

    Features:

    Easy to handle ultra-thin blade; Blade dicing

    after laser grooving; Variety of different grit

    concentrations; Shows stable processing

    performance in high load processing

     

     

     

     

     

     

    Hub dicing blade

    Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

     

    resin dicing blade

     

    resin dicing blade

    Features:

    High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials

     

     

     

     

     

     

     

     

     

     

    Hubless dicing

    blade

    Application:

    Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

    metal dicing blade

     

    metal dicing balde

    Features:

    High rigidityminimized wavy and slant cutti

    g ; Able to control diamond concentration to

    achieve cutting quality ;Excellent rigidit and

    cut quality

    Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP,

    Electroformed dicing balde

    Electroformed dicing

    balde

    Features:

    Wide selection of blade options; Proprietary

    thin-blade technology ;Blade thickness - 0.0

    15 mm to 0.3 mm; Available for both dicing

    saws and slicers

    Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
    Other specification can be produced according to customer’s requirements anna.wang@moresuperhard.com

    Contact Details
    More Super Hard Products Co., Ltd

    Send your inquiry directly to us (0 / 3000)